Reusing by-product in same BOM
Hi,
We have a requirement where sworf (by-product) created during a machining operation on a subassembly is being used as a component in the same Bill 2 levels below.
A simplified BOM structure for understanding can be as follows;
Sub-assembly
|
|--------------------------------|
Sworf Ingot
(By-Product) |
Sworf
Can ASCP planning support such type of BOM definition? Or will it go in a loop?